MIL-STD-883 Testing
With over 40 years of component and product testing experience, Sypris Test &
Measurement has the right equipment, right standards, and right people to meet
your critical MIL-STD-883 testing needs.
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within
military and
aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations.
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MIL-STD 810G Testing Seminar
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November
1-4, 2010
Location:
Orlando, FL
Click the image to the right to find out more.
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We are DSCC suitable for many of the below methods:
Method No. Environmental Tests
1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.8 Steady state life
1006 Intermittent life
1007 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere (corrosion)
1010.8 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.12 Seal
1015.9 Burn-in test
1016.1 Life/reliability characterization tests
1017.2 Neutron irradiation
1018.5 Internal gas analysis
1019.7 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.2 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.2 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure (due to alpha articles)
1033 Endurance life test
1034.1 Die penetrant test (for plastic devices)
Mechanical Tests
2001.2 Constant acceleration
2002.4 Mechanical shock
2003.8 Solderability
2004.5 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.3 Vibration, variable frequency
2008.1 Visual and mechanical
2009.9 External visual
2010.11 Internal visual (monolithic)
2011.7 Bond strength (destructive bond pull test)
2012.7 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.13 Resistance to solvents
2016 Physical dimensions
2017.8 Internal visual (hybrid)
2018.4 Scanning electron microscope (SEM) inspection of metallization
2019.7 Die shear strength
2020.8 Particle impact noise detection test
2021.3 Glassivation layer integrity
2022.2 Wetting balance solderability
2023.5 Nondestructive bond pull
2024.2 Lid torque for glass-frit-sealed packages
2025.4 Adhesion of lead finish
2026 Random vibration
2027.2 Substrate attach strength
2028.4 Pin grid package destructive lead pull test
2029 Ceramic chip carrier bond strength
2030 Ultrasonic inspection of die attach
2031.1 Flip chip pull-off test
2032.2 Visual inspection of passive elements
2035 Ultrasonic inspection of TAB bonds
2036 Resistance to soldering heat
Accreditations
For more information on MIL-STD-883 Testing, call 800-454-1772.